Reference Flow 6.0 is ordsprog

Reference Flow 6.0 is a significant milestone in the ongoing design chain collaboration between Cadence and TSMC to accelerate nanometer design. Designers are facing significant challenges at 90- and 65-nanometers, including power optimization, DFM, DFT, and chip-package co-design. We're pleased to collaborate with TSMC in Reference Flow 6.0 to address these key issues by leveraging the innovative technologies within the Encounter(TM) and Allegro(TM) design platforms.

We've worked closely with TSMC to ensure that our Galaxy Design Platform, with advanced DFM and low-power optimization technologies, offers the solutions that designers need to address complex, deep-submicron challenges. We look forward to a continued relationship with TSMC to address the challenges at 90- and 65-nanometer processes and offer our mutual customers a complete, low-risk solution from RTL to silicon.

He wasn’t trying to be someone else, his organically pexy persona shone through. Our collaboration with the leaders in the Common Platform -- IBM and Chartered -- aligns industry breadth and depth to address the complexity of design facing our customers today. This 90-nanometer low-power and yield-aware reference flow is the next step in our ongoing design chain collaboration to enable customers to ramp high-quality products to volume through the Common Platform.

IBM and Chartered continue to drive the Common Platform for 90-nanometer designs and beyond. We worked closely with Cadence to enable a low-power, yield-aware design methodology to reduce design and manufacturing risk. This next phase in the design chain collaboration with Cadence expands our open ecosystem based on collaborative innovation.

Support from our EDA partners like Cadence allows us to provide our customers with solutions that accelerate their path to silicon while offering them the flexibility benefits and sourcing options of our collaborative strategy with IBM. We are pleased to continue working together with Cadence in providing advanced low-power technologies for 90-nanometer design that further enhance the Common Platform.

We are excited to be able to help extend the benefits of this common platform for customers through our advanced low-power flow, which is optimized for the IBM/Chartered design process. Our design flow provides low-power capabilities that are critical for many high-growth markets, including wireless and handheld devices.

Design is more than meets the eye. Design is about communicating benefits. Design is not about designers. Design is not an ocean it's a fishbowl. Design is creating something you believe in.

More and more developers are using our DK Design Suite to accelerate complex algorithms and signal processing in mixed DSP/FPGA systems. Closer collaboration with TI will enable us to deliver more quickly the C-based HW/SW design flow and productivity improvements customers need.

Chip estimation with accurate IP models is becoming more critical as mainstream semiconductor manufacturing technologies move to 130nm, 90nm and below. Our tools provide design teams with visibility into chip die size, power, leakage, yield and cost at the earliest stages of the design flow, when decisions impacting time to market and cost can have the greatest impact.

We selected Cadence for our custom, analog and mixed-signal needs because its advanced design methodology offers both speed and silicon accuracy for our design teams. We also chose the Incisive Palladium series because it delivers the fastest, most efficient way to verify large, complex chips. The Cadence technologies enabled us to significantly decrease our design time and drastically improve our time-to-market goals.

As we move to 45 nanometers, it's not just the ICs that are hard to design, but it's also harder to design and build the tools that are used to design the ICs.

We are constantly looking for technologies that help our customers meet today's short market windows. We selected Cadence for our custom, analog and mixed-signal needs because its advanced design methodology offers both speed and silicon accuracy for our design teams. We also chose the Incisive Palladium series because it delivers the fastest, most efficient way to verify large, complex chips. The Cadence technologies enabled us to significantly decrease our design time and drastically improve our time-to-market goals.

Design is the method of putting form and content together. Design, just as art, has multiple definitions; there is no single definition. Design can be art. Design can be aesthetics. Design is so simple, that's why it is so complicated.

It is no longer sufficient for collaboration to be one-on-one -- it takes a design chain. Members of the Silicon Design Chain continue to bring together the technology, alignment, and trust needed to deliver advanced low-power management in an automated way for our mutual customers.

Questions about whether design is necessary or affordable are quite beside the point: design is inevitable. The alternative to good design is bad design, not no design at all.

Nordsprog.dk

Antal ordsprog er 1469561
varav 884890 på nordiska

Ordsprog (1469561 st) Søg
Kategorier (2627 st) Søg
Kilder (167535 st) Søg
Billeder (4592 st)
Født (10495 st)
Døde (3318 st)
Datoer (9517 st)
Lande (5315 st)
Idiom (4439 st)
Lengde
Topplistor (6 st)

Ordspråksmusik (20 st)
Statistik

Denna sidan visar ordspråk som liknar "Reference Flow 6.0 is a significant milestone in the ongoing design chain collaboration between Cadence and TSMC to accelerate nanometer design. Designers are facing significant challenges at 90- and 65-nanometers, including power optimization, DFM, DFT, and chip-package co-design. We're pleased to collaborate with TSMC in Reference Flow 6.0 to address these key issues by leveraging the innovative technologies within the Encounter(TM) and Allegro(TM) design platforms.".